Full-screen small and medium-sized LCD panels are in high demand

Although Apple and Samsung Electronics smart phones have adopted small and medium-sized OLED panels, judging from the recent situation of the recent Android camp mobile phone manufacturers’ new phones and the strong assembly of Apple’s 6.1-inch LCD iPhone, the full-screen small and medium-sized The size of the TFT LCD panel is still an important choice for major mobile phone brands to consider cost competitiveness and performance. This trend will gradually warm up the demand for LCD driver ICs in the second half of 2018.

Testing supply chain vendors said that the wafer test probe card manufacturer Wang Silicon recently turned to the panel driver IC test order, and its operations are expected to rise significantly in July. As for the packaging and testing plants Qibang and Nanmao The TDDI IC and COF packaging and testing production capacity has been fully loaded, and the industry is optimistic that the full-screen LCD panel mobile phone will continue to show its strength in the second half of the year.

Packaging and testing manufacturers frankly said that at present, most of the business opportunities such as OLED panels and driver ICs, packaging and testing, etc., are mostly in Samsung’s hands. Taiwanese suppliers have actually not benefited much, and Taiwanese IC design manufacturers are very strange. The OLED driver IC-related businesses of Jing, Novatek, and the back-end packaging and testing plants Qibang and Nanmao are to improve. It is still necessary to look forward to the mainland panel makers catching up in the LCD for Samsung field, and Taiwanese manufacturers will have the opportunity to grow after receiving orders. Packaging and testing manufacturers It is expected that the actual contribution of OLED panel-related performance will have to wait until after 2019.

Supply chain manufacturers said that although the self-luminous characteristics of OLED can achieve the characteristics of light, thin, short, high contrast, mobile phone brand manufacturers do not want the panel source and supply system to be concentrated in the hands of specific Korean manufacturers. Moreover, the LCD panel camp can still counteract the OLED camp with Mini LED backlight. Taiwanese supply chain manufacturers including LED, panel, driver IC design, foundry, packaging and testing will continue to benefit.

The industry has reported that Apple will have a large proportion of the 6.1-inch LCD version of the iPhone in 2018. In the second half of the year, Qibang, an LCD driver IC packaging and testing company, is expected to benefit directly, and Qibang is also cooperating with Apple in fine pitch COF substrate, the important growth momentum of Qibang in the second half of 2018, including COF, TDDI IC packaging and testing, etc., is expected to break out in the third quarter.

Because Apple's strength over the LCD version and the price-competitive new iPhone will make the full-screen Android mobile phone camp feel at ease. After all, not every mobile phone manufacturer can guarantee the production capacity of OLED panels, and The full-screen design trend will benefit Taiwanese LCD driver IC design, packaging, and testing manufacturers, including Qibang, Nanmao, and Wang Silicon, which will significantly improve their operations in the third quarter.

The LCD camp takes into account both performance and price competitiveness. The trend of full-screen design drives the increase in demand for COF packaging, testing, and substrates. The two major Taiwanese COF substrate manufacturers, Yihuadian and Qibang, are divided into non-apples and apples. With orders from the two camps, supply chain manufacturers expect that the Taiwanese COF substrate plant will explode in July.

As for the probe card manufacturers on the wafer test side, in the first half of 2018, they are facing a period of non-connection of new and old products. However, this impact is expected to be alleviated in July, winning most LCD driver IC wafer test For Wang Silicon alone, its operations will improve significantly after entering the third quarter. Although Wang Silicon’s micro-electromechanical (MEMS) probe card products for mobile phone high-end APs will not become clear until the end of the year at the earliest, it will be tested in the middle and low-end driver ICs. With the probe card part, Wang Silicon has a competitive advantage. As the demand for display driver ICs gradually recovers and IC design manufacturers begin to rush, Wang Silicon is expected to step out of the bottom of its operation.

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